TROI-7700E

SMT in-line 3D Solder Paste Inspection (SPI) system
Dual projection
Combination of 2D & 3D inspection eliminates common shadow problem with SPI systems
High speed & performance
Patented color enhancing algorithm TROI™ overcomes the problems faced by conventional SPI methods that could only calculate heights above silk print levels
Real-time process management & quality management solutions
Wide range of models cater for different board size
Single lane models: TROI-7700E / TROI-7700EL
Dual lane models: TROI-7700ED / TROI-7700EDL

2D Vision Algorithm	Vision inspection algorithm
3D Vision Algorithm	Phase measuring profilometry (PMP) algorithm
Measurement	Volume, height, XY Position, area
Detection Type	Insufficient paste, excessive paste, no paste, shape deformity, bridge 2D & 3D, paste displacement
Camera	4 MP
X/Y Pixel Resolution	15 μm
Field of View (FOV)	30 x 30 mm
Motor Type	Servo motor + Ball screw

Solutions