Solutions
Shuttlestar
SV-650A
- BGA rework machine
- With top and bottom hot air nozzles which are movable in Z direction
- Max. board size up to 550 x 500 mm
- Real-time display of temperature profile for analysis
- Automatic suction,soldering and solder removal
- Various sizes of hot air nozzles are available
| Dimensions: L x W x H | 746 x 710 x 820 mm |
| PCB size: L x W | 20 x 20 - 540 x 450 mm |
| PCB thickness | 0.5 - 4.0 mm |
| Applicable chip | 1 x 1 - 80 x 80 mm |