Solutions
JTU
SS-165M
- Solder paste management
- All-in-one fully automatic system (Refrigeration, thawing & stirring)
- Intelligent inventory management system
- Full automation with controlled solder paste quality
- Maintain optimum conditions for solder paste storage
- Error-proof operations
- Full traceability and reliability
- First-In-First-Out (FIFO) mechanism
- Industry 4.0 ready
| Dimension | L1,460 x W1,490 x H2,000 mm |
| Weight | 1200 kg |
| Storage/Refrigeration capacity | 165 Jars |
| Thawing capacity | 40 Jars |
| Applicable solder paste packaging | 500g Jar |
| Feeding quantity | Max. 28 Jars at once |
| Refrigeration temperature | 1 - 10°C (Uniformity ±3°C) |
| Thawing temperature | 18 - 28°C (Room temperature) |
| Stirring capacity | Half jar, 1 jar or 2 jars simultaneously |