JTU
SS-165M
  • Solder paste management
  • All-in-one fully automatic system (Refrigeration, thawing & stirring)
  • Intelligent inventory management system
  • Full automation with controlled solder paste quality
  • Maintain optimum conditions for solder paste storage
  • Error-proof operations
  • Full traceability and reliability
  • First-In-First-Out (FIFO) mechanism
  • Industry 4.0 ready
Dimension L1,460 x W1,490 x H2,000 mm
Weight 1200 kg
Storage/Refrigeration capacity 165 Jars
Thawing capacity 40 Jars
Applicable solder paste packaging 500g Jar
Feeding quantity Max. 28 Jars at once
Refrigeration temperature 1 - 10°C (Uniformity ±3°C)
Thawing temperature 18 - 28°C (Room temperature)
Stirring capacity Half jar, 1 jar or 2 jars simultaneously

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