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RW-E6250

◆ Shuttlestar
Brand :
◆ Rework Machine
  • Description
  • Specifications
  • BGA rework machine
  • Can rework all types of CSP, BGA, CGA and handle 775 socket, 478 socket, XBOX360, PS2/3 etc
  • Rework process under nitrogen environment
  • Equipped with over-heat protection function
  • Equipped with large IR area heater which heats the PCB evenly to avoid deformation and keep soldering effect
  • Equipped with different alloy hot air nozzles, easy to replace and able to locate in any angle
Dimensions 850(L) x 700(W) x 950(H) mm
Weight Approx. 150 kg
Workable PCB dimensions 20 x 20 - 450 x 500 mm
Workable PCB thickness 0.5 - 4 mm
Workable BGA dimensions 1 x 1 - 70 x 70 mm
Min. pitch of BGA ball 0.15 mm
Max. BGA weight 300 g
Placement precision 0.01 mm