JTU
HCZ-250
  • HCZ series vertical oven with minimum heat loss
  • Suitable for underfill and encapsulant curing
  • Vertical design helps saving space and cost
  • Consistent process control with minimum human intervention and mistakes
  • High throughput and productive
  • Perfect solution for long curing process
Dimension L2100 x W1750 x H2050 mm
Weight Approx. 1500 KG
Max. PCB size L300 x W250 mm
Object weight Max. 2 KG per level
Temperature control method PID closed loop control + SSR drive
Temperature set-up range Room temp. ~ 200°C
Heating configuration 4*2 = 8 heating modules
Heating power 8*6 kW = 48 kW
Temperature control precision ± 1°C

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