Solutions
.png)
Shuttlestar
RW-E6250
- BGA rework machine
- Can rework all types of CSP, BGA, CGA and handle 775 socket, 478 socket, XBOX360, PS2/3 etc
- Rework process under nitrogen environment
- Equipped with over-heat protection function
- Equipped with large IR area heater which heats the PCB evenly to avoid deformation and keep soldering effect
- Equipped with different alloy hot air nozzles, easy to replace and able to locate in any angle
| Dimensions | 850(L) x 700(W) x 950(H) mm |
| Weight | Approx. 150 kg |
| Workable PCB dimensions | 20 x 20 - 450 x 500 mm |
| Workable PCB thickness | 0.5 - 4 mm |
| Workable BGA dimensions | 1 x 1 - 70 x 70 mm |
| Min. pitch of BGA ball | 0.15 mm |
| Max. BGA weight | 300 g |
| Placement precision | 0.01 mm |